Applied Materials has introduced three new chipmaking systems that are set to mark the beginning of the 'angstrom' and 3D ...

BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment. The company plans ...