Semiconductor Engineering

Let’s Do The (IC Design) Time Warp Again

For the most part, we’ve all been doing integrated circuit (IC) and system-on-chip (SoC) layout the same way for decades. Designers put together the design, be it intellectual property (IP), block, or ...
Electronic Design

Realizing the Promise of Electrically-Aware Custom IC Design

Fig 1. Shown is an example of a tabular view and a graphical view of an electromigration analysis. In this view, the designer can sort by columns, quickly search and compare data, and cross-probe ...
EDN

UMC-certified design flow speeds analog/mixed-signal design

The Cadence analog/mixed-signal (AMS) IC design flow is now certified for UMC’s 22-nm ultra-low power and ultra-low leakage process technologies. This flow optimizes process efficiency and shortens ...
EDN

Analog design flow certified for UMC’s 22ULP/ULL process

Cadence Design Systems has optimized its analog and mixed-signal IC design flow for UMC’s 22ULP/ULL process technologies targeted at 5G, Internet of Things (IoT), and display applications. The ...
Business Wire

UMC and Cadence Collaborate on Analog/Mixed-Signal Flow for 22ULP/ULL Process Technologies

SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...