FineSim SPICE 2018.09 delivers 3X faster runtime for analog circuits, adds RF analysis features Custom Compiler's Extraction Fusion with StarRC provides early parasitics for accurate pre-layout ...
As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity.
Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X New Synopsys certified AI-driven digital and analog ...
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