Quick Read AI inference, reasoning, and larger context windows are driving an unprecedented surge in demand for both ...

RBC Capital Markets expects semiconductor revenue stemming from artificial intelligence applications to grow from $220B in ...

Massive hyperscaler capacity buildouts drove up global semiconductor spending by 21% year over year to $793 billion in 2025, ...

Gartner: 2025 semiconductor revenue +21% to $793B on AI chip demand; Nvidia leads as AI spend nears $1.3T in 2026.

SK Hynix, Samsung, TSMC, and Micron are investing billions to meet demand for high-bandwidth memory and advanced chips for the AI boom.

With capacity shifting to high-margin HBM for AI data centers, traditional DRAM supply is collapsing, pushing enterprise IT ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...

SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...

New X-HBM architecture delivers a 32K-bit wide data bus and potentially 512 Gbit per die density, offering 16X more bandwidth or 10X higher density than traditional HBM "X-HBM is not an incremental ...

MILPITAS, Calif.--(BUSINESS WIRE)--Sandisk Corporation (NASDAQ: SNDK) today announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking High ...

Companies Sign Memorandum of Understanding to Establish HBF Memory Technology Specification MILPITAS, Calif.--(BUSINESS WIRE)-- Sandisk Corporation (NASDAQ: SNDK) today announced it has signed a ...