3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...

Magma(r) Design Automation Inc. (Nasdaq:LAVA – News), a provider of chip design software, today announced that the Talus(r) IC implementation system has been included in TSMC Reference Flow 10.0. With ...

HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified ...

Cadence Design Systems and Tower Semiconductor have jointly released a silicon-validated SP4T RF SOI switch reference design flow that uses Cadence's Virtuoso Design Platform and RF Solution. The ...

Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...

Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and ...

TSMC has three silicon-validated Reference Flows for 16nm finfet processes and through-transistor stacking for 3D packaging. There is a 16Finfet Digital Reference Flow offering design support ...