An oxide pushes the bandgap even further. But will it prove too hot to handle? By Chris Edwards.

The programme, named Accelerated Manufacturing for PCSEL Packaging Solutions (AMPPS), focuses on developing scalable, ...

XP Power introduces the LBA series, a range of low-profile, enclosed AC-DC power supplies for industrial applications.

Diodes strengthens position in automated test equipment market with acquisition Credit: adobe.stock.com Diodes Incorporated ...

Cadence's AuraStack AI Super Agent designed for printed circuit board (PCB) and advanced packaging development.

TSMC has announced plans to invest an additional $100 billion in Arizona, in a boost to US semiconductor manufacturing.

FocalPoint and ST to bring an enhanced global navigation satellite system (GNSS) solution to the automotive market.

Intel may manufacture the majority of the compute tiles for its forthcoming Nova Lake processors at its own foundry.

The UK-India Free Trade Agreement (FTA), which has just come into force, should change the way British companies, and ...

Silicon Microgravity has secured £6mn in funding to support expansion of its manufacturing and engineering capabilities.

ASML has increased its financial outlook for 2026 and unveiled plans to expand manufacturing capacity after reporting ...

Infineon Infineon Technologies has introduced the RIC70115, a radiation-hardened gallium nitride (GaN) high-electron mobility ...