CuspAI has successfully raised $450m to accelerate AI-driven materials discovery for next generation technologies.

How to address complex power delivery challenges in adaptive system-on-chip (SoC) devices for modern electronic systems.

Powell Electronics has announced the availability of Incon’s full range of MIL-C-55302 PCB and cable connectors.

Digital Catapult has selected eleven organisations to join the third cohort of its Quantum Technology Access Programme.

Microchip Technology has launched a new industrial-grade Power over Ethernet (PoE) midspan for IIoT applications.

Variscite and medtech engineering company NRG have announced a partnership aimed at helping medical device developers.

Siemens Cre8Ventures and Cloudberry VC aim to accelerate the commercialisation of deep-tech innovation across Europe.

Emerson has launched a new modular testing architecture to help automotive engineers address more complex systems.

How TeleCANesis focuses on simplifying system integration to enable connected systems that are growing more complex.

Cadence's AuraStack AI Super Agent designed for printed circuit board (PCB) and advanced packaging development.

Scottish photonics company Vector Photonics has launched a new manufacturing initiative aimed at tackling packaging ...

TSMC has announced plans to invest an additional $100 billion in Arizona, in a boost to US semiconductor manufacturing.