The Power Delivery Network (PDN) is the backbone of ASIC design. It is used to supply clean power to active circuits in the IC. Voltage drop on the power rails can result in degraded performance, ...
Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...
Part 1 of this 3-part series described how a model-driven development process and virtual prototyping tools help address the challenges of implementing a DFSS methodology in a complex automotive ...
A new cell-free platform rapidly identifies optimal enzyme combinations for sustainable fuels and materials. Northwestern University synthetic biologists have developed a new rapid-prototyping system ...
How advances in semiconductor prototyping are helping optimize and create efficiencies in semiconductor chip manufacturing and development. Why semiconductor prototyping is a crucial step in the ...
Prototyping: With the use of CAD and massive amounts of digital simulation software available, it can often seem superfluous to make early appearance models, or even undertake early testing of new ...
As ystem-on-chip (SoC) designs continue to grow in complexity and integration, there is a constant push to adopt new system design methodologies in order to meet product schedules. Devices have gotten ...
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