A research team led by Professor Youngwook Kim from the Department of Physics and Chemistry, DGIST, in collaboration with the ...
Intel Corp. announced a collaboration with SoftBank Corp. subsidiary SAIMEMORY to develop a memory technology called the ...
Intel has partnered with SoftBank subsidiary Saimemory for the development of stacked DRAM-based memory technology that the ...
During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...
NEC Electronics with Elpida Memory and Oki Electric, has developed technology to allow cell phones and portable devices to have as much memory as a high-performance computer. Single Package Can House ...
TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...
SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
Designed for Intel's 0.65-mm pitch FS CSP336 stacked ICs, the SG-BGA-7022 memory socket specifies a 10 GHz bandwidth and a contact resistance of 10 m?. The socket features a precision design that ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
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