Let’s start with…. the end. The old saying, "you get out, what you put in”, is possibly the easiest way to summarise the ...

The multi-channel Synopsys PHY IP for PCI Express® (PCIe®) 6.0 meets today’s demands for higher bandwidth and power efficiency across network interface card (NIC), backplane, and chip-to-chip ...

T2M announces the availability of its partner’s Bluetooth V6.0 RF Transceiver IP Core in 22nm ULL and 40nm ULP.

In case you missed it at the 2024 Samsung Developer Conference today, our partners at Samsung Visual Display discussed the ...

Digital electronics has profoundly changed musical instrument design. From toy keyboards to performance-grade pianos, ...

Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify ...

Memory has been selected as the 2024 TSMC Open Innovation Platform® (OIP) Partner of the Year for Specialty Embedded Memory ...

MosChip DigitalSky™ empowers global enterprises with innovative digital solutions for seamless connectivity and intelligence ...

Worldwide, 300mm fab equipment spending is projected to grow by 4% to US$99.3 billion in 2024, and further increase by 24% to ...

This blog post summarizes a keynote presentation by our CEO Ron Black at the RISC-V Summit Europe 2024. You can watch a ...

QuickLogic today announced the successful delivery of eFPGA IP for TSMC's N12e 12nm process to a large multi-national ...

State-of-the-art cryptographic IP and decades of experience in the Israel semiconductor market offer Israeli chip designers a ...